IEC 60749-15 Edition 2.0-2010 半导体器件.机械和气候试验方法.第15部分:透孔安装设备对焊接温度的抗性

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【英文标准名称】:Semiconductordevices–Mechanicalandclimatictestmethods.Part15:Resistancetosolderingtemperatureforthrough-holemounteddevices
【原文标准名称】:半导体器件.机械和气候试验方法.第15部分:透孔安装设备对焊接温度的抗性
【标准号】:IEC60749-15Edition2.0-2010
【标准状态】:现行
【国别】:国际
【发布日期】:2010-10-01
【实施或试行日期】:2010-10-01
【发布单位】:国际电工委员会(IX-IEC)
【起草单位】:IEC
【标准类型】:()
【标准水平】:()
【中文主题词】:
【英文主题词】:
【摘要】:ThispartofIEC60749describesatestusedtodeterminewhetherencapsulatedsolidstatedevicesusedforthrough-holemountingcanwithstandtheeffectsofthetemperaturetowhichtheyaresubjectedduringsolderingoftheirleadsbyusingwavesolderingorasolderingiron.Inordertoestablishastandardtestprocedureforthemostreproduciblemethods,thesolderdipmethodisusedbecauseofitsmorecontrollableconditions.Thisproceduredetermineswhetherdevicesarecapableofwithstandingthesolderingtemperatureencounteredinprintedwiringboardassemblyoperations,withoutdegradingtheirelectricalcharacteristicsorinternalconnections.Thistestisdestructiveandmaybeusedforqualification,lotacceptanceandasaproductmonitor.Thistestis,ingeneral,inconformitywithIEC60068-2-20but,duetospecificrequirementsofsemiconductors,theclausesofthisstandardapply.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:18P.;A4
【正文语种】: